MP polishing sponge medium 79 mm black (Mipa)

MP Polishing Sponge Medium 79 mm is a compact foam polishing pad for small area machine work where a full size pad would be too large. The 79 mm diameter gives better access on local sections, tighter curves and detail zones that need more controlled polishing movement.

This medium version uses a soft open pore foam structure intended for re polishing and finishing polish steps. It is suited to refining the result after a stronger correction stage and to handling smaller polished sections where the aim is surface clarity and a cleaner finish rather than a heavy cutting action.

The Velcro backing keeps pad changes quick, which helps when switching between polishing stages or replacing a pad during repeated detail work. The black foam format also makes this pad easy to recognise among other polishing densities and sizes.

For local finishing, smaller machine setups and compact polishing tasks, this 79 mm pad gives a practical combination of manageable size, soft foam response and straightforward Velcro mounting.

What is it used for?

• Re polishing and finishing on small areas
• Using a 79 mm pad on tighter sections
• Switching pads quickly with Velcro backing
• Refining the finish with soft open pore foam

Technical data